pb lead-free parts ligitek electronics co.,ltd. property of ligitek only LSE3330-PF data sheet round type led lamps 03 - jun a doc. no : qw0905- rev. : date : LSE3330-PF - 2006
25.0min 0.5 typ note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation + - 1.0min 2.54typ package dimensions LSE3330-PF part no.1/5 page 7.6 8.6 1.5max 5.0 5.9 ligitek electronics co.,ltd. property of ligitek only
absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) ma 80 i fp peak forward current duty 1/10@10khz max. forward voltage @ ma(v) color orange diffused note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. emitted LSE3330-PFgaasp/gap orange material part no min. lens 61045 1.72.6 peak wave length pnm spectral halfwidth nm 20 reverse current @5v power dissipation operating temperature storage temperature tstg t opr pd ir -40 ~ +85 -40 ~ +100 80 10 min. typ. 18 8.036 viewing angle 2 1/2 (deg) luminous intensity @10ma(mcd) mw a ligitek electronics co.,ltd. property of ligitek only symbol forward current parameter i f se 20 ratings unit ma page 2/5 part no.LSE3330-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 se chip page 3/5 part no.LSE3330-PF
60 seconds max page 4/5 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) temp( c) 260 5 /sec max 260 c3sec max time(sec) 100 150 2 /sec max 120 25 preheat 0 0 50 dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no.LSE3330-PF
page 5/5 reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test itemtest condition reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. ligitek electronics co.,ltd. property of ligitek only mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solder resistance test high temperature high humidity test thermal shock test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. part no.LSE3330-PF
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